Electronic Packaging Thermal Management Materials

Education
2008/09–2012/06: Dalian University, Bachelor of Engineering in Chemical Engineering and Technology
2012/09–2015/06: Southwest University of Science and Technology, Master of Engineering in Chemical Engineering and Technology
2016/09–2020/07: University of Chinese Academy of Sciences (UCAS), Ph.D. in Materials Physics and Chemistry

Professional Experience
2015/07–2016/08: Ningbo Institute of Materials Technology and Engineering, CAS, Senior Research Assistant
2020/07–2025/11: Ningbo Institute of Materials Technology and Engineering, CAS, Special Appointment Young Researcher
2025/11–present: Ningbo Institute of Materials Technology and Engineering, CAS, Associate Professor

2025: Second Prize, Director's Special Award, Ningbo Institute of Materials Technology and Engineering (NIMTE), CAS
2025: Materials Horizons Rising Young Scientist Award
2020: Third Prize, Director's Scholarship, Ningbo Institute of Materials Technology and Engineering (NIMTE), CAS
2019: CAS President's Scholarship (Outstanding Award)
2019: Zhu Li Yuehua Scholarship, University of Chinese Academy of Sciences (UCAS)

[1]\tDai, W.; Lv, L.; Lu, J.; Hou, H.; Yan, Q.; Alam, F. E.; Li, Y.; Zeng, X.; Yu, J.; Wei, Q.; et al. A Paper-Like Inorganic Thermal Interface Material Composed of Hierarchically Structured Graphene/Silicon Carbide Nanorods. ACS Nano 2019, 13 (2), 1547-1554.
[2]\tDai, W.; Ma, T.; Yan, Q.; Gao, J.; Tan, X.; Lv, L.; Hou, H.; Wei, Q.; Yu, J.; Wu, J.; et al. Metal-Level Thermally Conductive yet Soft Graphene Thermal Interface Materials. ACS Nano 2019, 13 (10), 11561-11571.
[3]\tDai, W.; Lv, L.; Ma, T.; Wang, X.; Ying, J.; Yan, Q.; Tan, X.; Gao, J.; Xue, C.; Yu, J.; et al. Multiscale Structural Modulation of Anisotropic Graphene Framework for Polymer Composites Achieving Highly Efficient Thermal Energy Management. Advanced Science 2021, 8 (7), 2003734.
[4]\tDai, W.; Ren, X.-J.; Yan, Q.; Wang, S.; Yang, M.; Lv, L.; Ying, J.; Chen, L.; Tao, P.; Sun, L.; et al. Ultralow Interfacial Thermal Resistance of Graphene Thermal Interface Materials with Surface Metal Liquefaction. Nano-Micro Letters 2022, 15 (1), 9.
[5]\tDai, W.; Wang, Y.; Li, M.; Chen, L.; Yan, Q.; Yu, J.; Jiang, N.; Lin, C.-T. 2D Materials-Based Thermal Interface Materials: Structure, Properties, and Applications. Advanced Materials 2024, 36 (37), 2311335.
[6]\tGao, J.; Yan, Q.; Lv, L.; Tan, X.; Ying, J.; Yang, K.; Yu, J.; Du, S.; Wei, Q.; Xiang, R.; et al. Lightweight thermal interface materials based on hierarchically structured graphene paper with superior through-plane thermal conductivity. Chemical Engineering Journal 2021, 419, 129609.
[7]\tYing, J.; Tan, X.; Lv, L.; Wang, X.; Gao, J.; Yan, Q.; Ma, H.; Nishimura, K.; Li, H.; Yu, J.; et al. Tailoring Highly Ordered Graphene Framework in Epoxy for High-Performance Polymer-Based Heat Dissipation Plates. ACS Nano 2021, 15 (8), 12922-12934.
[8]\tTan, X.; Liu, T.-H.; Zhou, W.; Yuan, Q.; Ying, J.; Yan, Q.; Lv, L.; Chen, L.; Wang, X.; Du, S.; et al. Enhanced Electromagnetic Shielding and Thermal Conductive Properties of Polyolefin Composites with a Ti3C2Tx MXene/Graphene Framework Connected by a Hydrogen-Bonded Interface. ACS Nano 2022, 16 (6), 9254-9266.
[9]\tChen, L.; Liu, T.-H.; Wang, X.; Wang, Y.; Cui, X.; Yan, Q.; Lv, L.; Ying, J.; Gao, J.; Han, M.; et al. Near-Theoretical Thermal Conductivity Silver Nanoflakes as Reinforcements in Gap-Filling Adhesives. Advanced Materials 2023, 35 (31), 2211100.
[10]\tSun, L.; Wang, Y.; Chen, L.; Ying, J.; Li, Q.; Fu, L.; Yan, Q.; Wu, K.; Xue, C.; Yu, J.; et al. van der Waals-bonded graphene clusters enhance thermal conductivity of phase-change materials for advanced thermal energy management. Materials Horizons 2024, 11 (20), 5031-5044, 10.1039/D4MH00792A.