Scientists
杨华礼
Yang Huali
Professor
Laboratory of Magnetic Materials and Applications
Group:Flexible Magnetic-Electronic Materials and Devices
Research Interests
Flexible Magnetic Materials and Devices, including (1) the fabrication of flexible magnetic materials and magnetic sensor arrays, (2) modulation of the magnetic and electrical properties of flexible magnetic films, (3) applicaitons of flexible magnetic sensors in robotics and human-machine interaction
Representative Publications
1.Jiafeng Wu, Huali Yang, Mengting Zou, Yali Xie, Shengbin Li, Run-Wei Li*. Advances in magnetic materials and sensors for tactile perception. Review of Materials Research 2025, 1, 100110.
2.Lili Pan, Yali Xie*, Huali Yang*, Xilai Bao, Jinxia Chen, Mengting Zou, and Run-Wei Li*; Omnidirectionally Stretchable Spin-Valve Sensor Array with Stable Giant Magnetoresistance Performance, ACS Nano, 2025, 19(5): 5699-5708.
3.Xilai Bao, Huali Yang,* Yali Xie,* Jiabin Wang, Ri He, Pavlo Makushko, Lili Pan,Yubo Wang, Jinxia Chen, Mengting Zou, Ruoan Zou, Chenxu Liu, Lin Guo, Tao Zhu,Denys Makarov,* and Run-Wei Li*; Flexible Exchange-Biased Films with Superior Strain Stability, Advanced Functional Materials, 2024, 34(51): 2409844.
4.Huali Yang#, Shengbin Li#, Yuanzhao Wu,* Xilai Bao, Ziyin Xiang, Yali Xie, Lili Pan, Jinxia Chen, Yiwei Liu,* and Run-Wei Li*; Advances in Flexible Magnetosensitive Materials and Devices for Wearable Electronics, Advanced Materials, 2024, 36(37): 2311996.
5.Mengchao Li, Huali Yang,* Yali Xie,* Kai Huang, Lili Pan, Wei Tang, Xilai Bao, Yumeng Yang, Jie Sun, Xinming Wang, Shenglei Che, and Run-Wei Li*; Enhanced Stress Stability in Flexible Co/Pt Multilayers with Strong Perpendicular Magnetic Anisotropy, Nano Letters, 2023, 23(17): 8073-8080.
6.Huali Yang#, Qing Liu#, Zhaoliang Liao#, Liang Si, Peiheng Jiang, Xiaolei Liu, Yanfeng Guo, Junjie Yin, Meng Wang, Zhigao Sheng, Yuxin Zhao, Zhiming Wang, Zhicheng Zhong,* Run-Wei Li*; Colossal angular magnetoresistance in the antiferromagnetic semiconductor EuTe2, Physical Review B, 2021, 104: 214419.